HDI PCB

High Density Interconnect PCB Design use latest PCB manufacturing technologies available to increase the functionality of PCBs using the same or less amount of area. HDI PCBs are characterized by high-density attributes including laser microvias, fine lines and high-performance thin materials. This increased density enables more functions per unit area. Higher technology HDI PCBs have multiple layers of copper filled stacked microvias (Advanced HDI PCBs) which creates a structure that enables even more complex interconnections.

• 1+N+1 - PCBs contain 1 "build-up" of high-density interconnection layers.
• i+N+i (i≥2) - PCBs contain 2 or more "build-up" of high-density interconnection layers. Microvias on different layers can be staggered or stacked.
• Any Layer HDI - All the layers of a PCB are high density interconnection layers which allows the conductors on any layer of the PCB to be interconnected freely with copper filled stacked microvia structures ("any layer via").
• 2/2 mil line/space with 4/8 mil laser via capture pad size.
• Material options: High temperature FR4, Halogen – Free and High Speed (low loss).

A microvia maintains a laser drilled diameter of (typically 0.006" (150μm), 0.005" (125μm), or 0.004" (100μm),which are optically aligned and require a pad diameter (typically 0.012" (300μm), 0.010" (250μm), or 0.008"(200μm), allowing additional routing density. Microvias can be via-in-pad, offset, staggered or stacked, non conductive filled and copper plated over the top or solid copper filled or plated.

Microvias add value when routing out of fine pitch BGAs such as 0.8 mm pitch devices and below. Additionally, microvias add value when routing out of a 0.5 mm pitch device where staggered microvias can be used, however, routing micro-BGAs such as 0.4 mm, 0.3 mm, or 0.25 mm pitch device, requires the use of Stacked MicroVias using an inverted pyramid routing technique

• Allows increased routing on multiple layers.
• Standard Microvias limited to layers 1 - 2 & 1 - 3.
• Provides routing solutions for next generation small pitch packages of 0.5/0.4/0.3/0.25 mm.
• Provides solid copper plate eliminating potential solder voiding.
• Provides a Thermal Management Solution.
• Improves Current Carrying Capability.
• Provides a Planar surface for BGA.

A Deep Microvias & Deep Stacked MicroVias can be via-in-pad, offset, staggered or stacked, non conductive filled and copper plated over the top or solid copper filled or plated.

• Provide additional dielectric material.
• Maintains small geometries on multiple layers.
• Improved Impedance performance.
• Improved signal integrity.
• Provides RF Microvia solutions.
• Provides a solid copper plate.
• Improves Current Carrying Capability & Thermal Management.
• Provides a Planar surface for BGA (Via-in-Pad).

SLP get their name from the fact that they are so similar to the IC carrier board used in semiconductor packaging. The IC carrier board is a high-tech circuit board bearing one or more chips and other circuitry linking the semiconductor die to the package land pattern. Although substrate-like PCBs are venturing closer to the feature sizes seen in IC carriers, they are still considered PCBs since they have both active and passive components.

• 2,4,6 Layers (2+2+2 stacked via).
• BT material.
• Wire bonding types.
• ENEPIG
• Soft/Hard gold.
• IC Substrate Type: SIP, CSP, BOC & FC package.
• Fine trace width/space 25/25um.
• Thin board: 130um(2L), 170um(4L)
• Flip-chip C4 pad.