Signal Integrity, Power Integrity, Thermal, EMI, EMC, Reliability, DFM, DFA, DFT

Signal Integrity Analysis

System and PCB signal integrity analysis

Multi Board signal integrity analysis

Pre-Route and post-route PCB Si Analysis

• Reflection Waveform Analysis
• Crosstalk Analysis
• Propagation delay and timing analysis
• Eye Diagram Analysis



Library and model Development

• IBIS Model Creation
• IBIS Model validation

Pre Layout PCB SI Analysis Check

• Placement optimization, Trace length constraints
• Impedance requirement.
• Topology and termination strategies.

Post Layout PCB SI analysis check

• Verification by extraction of actual PWD parasitic.
• Placement optimization based on signal flow & trace length requirement of the specific interface.
• Layer stack-up recommendation.
• Reflections analysis and determination of termination scheme.
• Generation of PCB layout constraints & guidelines.
• Delay & Timing determination.
• Crosstalk level estimation.
• Eye diagram analysis.

Power Integrity Analysis

• Power Integrity can identify the potential problems and with appropriate modifications, validations it can identify problem on virtual prototypes.

DC Drop Analysis

• Modeling Power Plane structures to validate IR/DC drop in power supply
• rails due to copper losses.
• Output available in the form of a report indicating current flow and voltage at each power pins of circuit devices.
• 3D Plots generation representing voltage distribution through the power planes.
• Current density 3D plot.

Decoupling Analysis

• Analyzing the impedance of the power distribution network at multiple board locations and suggesting proper decoupling schemes.
• PCB layout Stack up suggestions for proper board decoupling.
• Frequency versus Impedance plot.

DC Noise Analysis

• Simulation of plane noise due to improper decoupling schemes.
• A 3D plot of plane noise.

System, PCBA, PCB Thermal analysis

• System and PCB Thermal Analysis, simulation, and Design.
• PCB data import through IDF files available from all EDA tools.
• Component Junction and case temperature computations.
• PCB Thermal profiles generation for components and PCB.
• Reports consist of board temperature and gradients, excess temperature, 3D airflow, and temperature distribution.
• Simulation of Metal Core Designs and verification of the cooling effects and application design modifications.
• Detection of hot spots and correction with heat transfer mechanisms analysis viz., Conduction, Convection, Radiation.
• Support on Heat Sink Design and cooling proposals.
• System and PCB Thermal analysis of applications like Defense, Avionics, Telecom, Medical, Computer, Automotive, and Power supplies.

Electronics Hardware reliability analysis

• System and PCB Reliability Analysis.
• System availability analysis.
• System maintainability analysis.
• System and PCBA Failure mode, effects, and criticality analysis (FMECA )as per MIL-STD-1629A.
• Uses Reliability diagram, Fault tree analysis, and applicable standard models.
• Failure rates and MTBF Analysis based on MIL-217 models.
• Reliability prediction as per Telcordia/ Bell core (TR-332/SR-332) models.
• Reliability Prediction as per IEC62380 models.
• Reliability Analysis consists of MTBF calculation for all components present in the card.
• MTBF vs Temperature range graph.
• Derating analysis.
• Reliability Reports with details of Failure rate by part type and Failure rate parts list.
• System and PCB Reliability Analysis for Defence and Aerospace Applications includes Airborne, Commercial, Naval, Missile, Ground Fixed and Ground Mobile.

EMI EMC simulation & analysis

• Printed circuit board Level and System level analysis.
• Radiated Emissions Analysis.
• Near Filed, Far Filed Emissions
• Net and Board level radiated emissions
• validation as per Compliance template of FCC, CISPR, VCCI, User
• Support and guidelines for selecting the appropriate filters for various applications.
• EMC Control Planning.
• EMI Test Plans and Procedures Development.
• EMI EMC Product design review.
• EMC Performance Requirements Definition.
• Design mitigation.
• Gap Analysis & Risk Mitigation Plans.
• Compliance risk assessments.
• Flow Down Requirements.

RF Simulation & Analysis

RF Simulation Process considers below aspects of PCB Design & PCB layout design:
• Material Selection
• Control of Impedance
• Trace Design
• Earth Plane, Ground Plane
• Shielding
• Via Management
• Component Placement
• Power Supply Decoupling
• RF Circuit Simulation
• Electronic (EM) Simulation
• RF System Simulation
• RF Antenna optimisation
• RF system Thermal Simulation
• RF system mechanical Simulation

DFX ( DFM, DFA, DFT) analysis

• Design for manufacturing (DFM) analysis.
• Design for assembly (DFA) analysis and evaluation.
• Design for Test (DFT) analysis as per specific test fixture requirements.
• Verification of inputs files for CAM Compatibility, generating reports on individual board characteristics against manufacturing spec.
• Verification of opens and shorts, Matching of drill data for accuracy.
• Layer Analysis for annular ring, space & trace widths, solder Mask, fiduciary openings & exposed traces.
• Silkscreen removal, scoring, V-cuts, routing, slot, route and retain, test coupons

Manufacturing Feasibility analysis, CAM

• Manufacturer’s requirement for volume manufacturing is very important aspects that need to be identified before design & building the prototypes.
• Using sketch data of PCB, PCA analyze product potential for manufacturing success.
• Manufacturing SWOT Analysis
• NPI & PPAP Process Mapping
• Compliance & Legal Assistance
• Cost/Profit /Risk Analysis
• First article inspection services ( FAI ) to ensure that produced parts are in accordance with the design data, the specification and customer expectations.