High-Reliablity Multilayer PCB manufacturing

Rigid PCB, Flexible PCB, Rigid Flex PCB, HDI PCB, RF PCB

MCPCB, Ceramic PCB, Hybrid PCB

PCB manufacturing - Rigid, Flexible, Rigid Flex, HDI, MCPCB, Hybrid RF, Ceramic

Argus Systems(AESPL) is leading PCB Fabrication and PCB assembly company in india, USA, and UK providing professional high quality multilayer Rigid pcb, Flexible, Flexi Rigid, Metal Core, and PTFE Teflon Printed Circuit Boards(PCB) for Avionics & defense (AS9100D, MIL-PRF, LCSO) , Medical (ISO 13485) , Automotive (IATF 16949 ) Instrumentation, and commercial applications. Argus technical expertise enables pcb design and fabrication at competitive prices. We specialize in different types of printed circuit boards including multilayer Rigid pcb, Flexible pcb, rigid flex pcb, metal core pcb and RF PCB.

Our PCB Fabrication capabilities support high-frequency pcb,High-temperature Boards,Thick pcb, ultra-thin pcb,heavy copper pcb,Metal Core pcb,HDI PCB with Blind Vias, Buried Vias, Micro Vias, Embedded passives, bonded heat sink, Impedance Control, Depth control drilling, Back drilling, Edge Plated pcb, Bump Pads, cavity with ledge, Via on pad and stacked micro-Via technology. Argus engineering team can work with you to review your pcb design to make sure that pcb manufacturing and pcb fabrication can be within budget constrained but without any compromise on quality. We excel in providing you with high quality PCB Fabrication and PCB manufacturing to meet your exact requirements.

As an established pcb design and PCB Fabricator with an in-depth understanding of the Printed Circuit Board domain including a complete product design life cycle, we have the competence to offer you the finest quality Printed Circuit Boards within the specification and quantity that you desire.



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High-Reliability Multilayer PCB Manufacturer

  • Multilayer PCB Fabricator of up to 60+ layers.
  • Embedded passives.
  • Heavy copper up to 10 oz.
  • Over 50 UL approved laminates
  • Panasonic, ITEQ, Isola, EMC, Nelco, Hitachi, Doosan, Rogers, Taconic, Shengyi, TUC
  • Multilayer PCB with Thickness up to 0.450".
  • Thin core dielectrics.
  • Dimensions up to 30" x 54".
HDI PCB

HDI PCB Manufacturer

  • Up to 12L "any-layer" stacked uVia Structure
  • 1.6/2.0 mil line / space
  • Wide material & surface finish selections
  • 14 mil, 6L ultra-thin structure.
  • 3/7 mil Via / Pad size.
  • 0.4 mm pitches BGA with 2 traces fan out.
  • Embedded, distributed, and discrete passive components.
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RF PCB manufacturer

  • High frequency and High bandwidth RF PCB manufacturing.
  • Planar and screened resistors.
  • RF PCB with Mixed dielectrics (hybrids).
  • Dielectric foam.
  • Conductive paste.
  • Plated cavities for RF PCB.
  • Formed (conformal) RF PCBs.
  • Optical machining.
Flex and Rigid Flex PCB Manufacturer

Multilayer flexible PCB & rigid flex PCB manufacturer

  • Double-sided, multilayer flexible PCB, and rigid-flex PCB.
  • 30+ layers.
  • Dimensions up to 24" x 48".
  • Acrylic, epoxy, and adhesive-less polyimide flex materials.
  • Over 50 rigid material options.
  • Thickness up 0.300".
  • Bikini cut, bookbinder, loose-leaf construction
PCB Thermal Management

MCPCB - Metal Core PCB Manufacturer

  • Passive and active designs.
  • Buried metal core PCB ( MCPCB ) with Aluminum, Copper, Copper Invar Copper.
  • Externally mounted heat sinks.
  • Epoxy and B-stage films.
  • Thermal & conductive bonding.
  • Aluminum & copper base materials for MCPCB
  • Various surface finishes
  • PCB Fabricator with In-house milling and bonding
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SLP - Substrate Like PCB Fabricator

  • 2,4,6 Layers (2+2+2 stacked via).
  • BT material.
  • Wire bonding types.
  • ENEPIG
  • Soft/Hard gold.
  • IC Substrate Type:SIP, CSP, BOC & FC package.
  • Fine trace width/space 25/25um.
  • Thin board: 130um(2L), 170um(4L)
  • Flip-chip C4 pad.
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Ceramic PCB Manufacturer

  • ceramic PCB boards with ceramic material like Aluminum Nitride, Aluminum Oxide, Boron Nitride, Beryllium Oxide, and Silicon Carbide.
  • Ceramic PCBs with higher thermal conductivity and a low expansion coefficient (CTE).
  • High temperature resistance and high electrical insulation performance
  • Good mechanical strength and can withstand high load including shock and vibration
  • Good chemical stability and Low Frequency loss
  • High-impedance tracing can be implemented easily
  • Less expensive than metal (Cu/ Al) core PCBs
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Hybrid PCB Fabricator

  • Hybrid constructions involving a low loss material, PTFE laminates such as Nelco or Rogers combined with another core material like FR-4.
  • Maximize the performance and reliability of high-frequency RF applications with our expert multilayer hybrid PCB manufacturing.
  • A hybrid PCB is a multilayer PCB that uses dissimilar materials with the intent of optimizing electrical performance and improving system reliability focused towards high-frequency RF applications.
  • Addressing The challenge of Hybrid PCB manufacturing by managing the different CTE properties of the dissimilar circuit materials during PCB fabrication.
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Multilayer PCB Fabrication standards

  • UL approval 94-V-0- for double sided , Multilayers and Rigid flex PCB
  • MIL-PRF-55110 Type 2- for GY.
  • MIL-PRF-55100 Type-3- for GF, GI, GM, BI
  • MIl-P50884 Type-4 for Rigid-flex PCB
  • MIL-PRF-31032
  • ISO 9001:2015
  • AS9100D ( Aerospace & Defense )
  • Nadcap
  • ISO 13485 ( Medical Devices )
  • IATF 16949 ( Automotive )
  • LCSO Approved
Multilayer Rigid, Fleixble, Rigid-Flex, Semi-flex PCB

Reach out to Argus to Discuss Your multilayer Rigid PCB, HDI PCB, Rigid-Flex PCB, flexible PCB, semi-flex PCB, Hybrid PCB, MCPCB, Cermaic PCB, Substrate Like PCB manufacturing Requirements.

Argus Systems (AESPL) a globally recognized multilayer PCB Design, PCB Manufacturing and PCB Assembly Services company supporting Multilayer PCB Fabrication (Rigid PCB manufacturing, Flexible PCB manufacturing, Rigid Flex PCB manufacturing, HDI PCB manufacturing, RF PCB manufacturing, Substrate Like PCB (SLP) manufacturing, Metal Core PCB ( MCPCB) manufacturing, Ceramic PCB manufacturing, Hybrid RF PCB manufacturing) and PCB Assembly for Its Global Clients in India, USA, and UK as per Automotive ( IATF 16949 ), Medical Devices (ISO 13485), Aerospace & Defense (AS9100D, MIL-PRF, LCSO) quality management standards.