- Multilayer boards up to 60 layers.
- Impedance-controlled. PCB
- 2 mil traces.
- Board thickness starting from 0.005 and up to 0.325 .
- Rigid, Flex, Rigid-Flex boards.
- Load boards.
- HDI/Blind/Buried technology.
- Thick back panels.
- High-temperature Printed circuit boards.
- High-frequency Printed circuit boards.
- Embedded Resistors / capacitance.
- Metal core boards.
- Bonded Heat Sinks.
- MIL grade and Aerospace application boards
- Support for prototyping to high volume production requirements.
Argus expertise enables PCB Fabrication at competitive prices. We specialize in different types of printed circuit boards including multi-layer Rigid PCB, Flexible PCB, rigid flex PCB and metal core PCB.
Our Printed Circuit Boards capabilities supports high frequency PCB, High temperature Boards, Thick PCB, ultra-thin PCB, heavy copper PCB, Metal Core PCB, HDI boards with Blind/Buried Vias, Embedded passives, bonded heatsink, Impedance Control, Depth control drilling, Back-drilling, Edge Plated PCB, Bump Pads, cavity with ledge, Via on pad and stacked micro-Via technology.
Our Printed Circuit Boards capabilities supports high frequency PCB, High temperature Boards, Thick PCB, ultra-thin PCB, heavy copper PCB, Metal Core PCB, HDI boards with Blind/Buried Vias, Embedded passives, bonded heatsink, Impedance Control, Depth control drilling, Back-drilling, Edge Plated PCB, Bump Pads, cavity with ledge, Via on pad and stacked micro-Via technology.
Argus Systems (AESPL) stands as a globally recognized leader in Electronic System Design and Electronics manufacturing services, Supporting Its ODM, OEM customers in Australia and New Zealand.