Electronic potting is a process of filling a complete electronic assembly with a solid or gelatinous compound for resistance to shock and vibration and for exclusion of moisture and corrosive agents.
In the potting process an electronic assembly is placed inside a mold which is then filled with an insulating liquid compound that hardens permanently protecting the assembly the mold is part of the finished article and can provide shielding or heat dissipating functions in addition to acting as a mold.
Conformal coatings are a protective, non-conductive dielectric layer that is added to a circuit board or electronic device. The coating conforms to the object being coated allowing protection without significant additions to the weight or thickness of the device.
